LG Innotek is seeking to take the lead in 3D sensing modules, which will become major components for premium smartphones, the electronics components manufacturing affiliate of LG Group said Tuesday.

"We recently began mass producing 3D sensors called time-of-flight (ToF) modules. We expect the ToF module will be widely used in high-end smartphones," LG Innotek said.

The ToF sensor is supplied by Infineon and assembled into a module by LG Innotek will be installed on the front face of the upcoming LG G8 ThinQ smartphone, which will enable recognizing objects in 3D and quickens the response time in face ID verification and other biometric solutions.

The firm said the ToF module is used for determining the distance to objects and recognizing their shape. Using this module, phone makers are able to provide enhanced biometric recognition security features, touch-less gestures and augmented and virtual reality features, the spokesman said. The module also helps users obtain better depth of field when taking photos, the spokesman added.

LG Innotek's ToF module is 4.6 millimeters thick, which is the slimmest in the industry. The 3D sensing market is expected to grow from $2.9 billion in 2018 to $9 billion in 2022, according to French market research firm Yole Developpement.

The LG G8 ThinQ high-end smartphone will be introduced during the Mobile World Congress (MWC) tech fair in Barcelona from Feb. 25 to 28.