Breaking News

Apple introduces iPhone 17e and new new iPad Air RayNeo Unveils RayNeo Air 4 Pro with Batman Edition at MWC 2026 ZTE Showcases Full-Stack AI Innovations at MWC Barcelona 2026, Creating an Intelligent Future Akasa Launches 1U Low-Profile Vapour Chamber CPU Cooler Xiaomi and Leica Camera AG Present the Xiaomi 17 Series

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

VIA enters license agreement with 3Com

VIA enters license agreement with 3Com

Enterprise & IT Nov 12,2004 0

VIA Technologies and 3Com Corporation today announced that the two companies have entered into a patent license agreement that grants VIA rights under certain 3Com patents. This agreement covers the licensing of specified 10/100 Ethernet controller chips developed and sold by VIA and its subsidiaries.

?Networking products constitute a key element of our platform strategy, comprising a broad range of discrete and integrated Ethernet-controller solutions for ultimate flexibility for our customers,? said Steven Lee, Executive Assistant to VIA president and CEO Wen-Chi Chen. ?This agreement with 3Com strengthens our ability to compete and provides our customers with an edge in this marketplace, enabling us to offer industry-leading technology as part of our portfolio,? added Lee.

While the specific terms of the license are confidential, the agreement covers past and future sales of VIA's licensed products. Under the terms of the agreement, VIA will make on-going royalty payments based on future sales.

Tags: VIA
Previous Post
Microsoft disputes SP2 hole claims
Next Post
Sandwich clusters may improve magnetic memory storage

Related Posts

  • VIA Launches the VIA Mobile360 M810 System

  • VIA Launches VIA Edge AI Developer Kit Powered by Qualcomm Snapdragon 820E Embedded Platform

  • VIA Launches VPai Slide 360-Degree Video Camera Platform

  • VIA Launches ARTiGO A900 Android System For IoT and M2M Deployments

  • VIA Now Offers New Viega Ruggedized Android Tablet

  • VIA Releases New AMOS-3003 Fanless System

  • VIA Sues Asus Group Companies and Executives for Damages in Trade Secrets Misappropriation Suit

  • VIA Announces New Fanless Quad Core ARM-Based Industrial System

Latest News

Apple introduces iPhone 17e and new new iPad Air
Smartphones

Apple introduces iPhone 17e and new new iPad Air

RayNeo Unveils RayNeo Air 4 Pro with Batman Edition at MWC 2026
Consumer Electronics

RayNeo Unveils RayNeo Air 4 Pro with Batman Edition at MWC 2026

ZTE Showcases Full-Stack AI Innovations at MWC Barcelona 2026, Creating an Intelligent Future
Smartphones

ZTE Showcases Full-Stack AI Innovations at MWC Barcelona 2026, Creating an Intelligent Future

Akasa Launches 1U Low-Profile Vapour Chamber CPU Cooler
Cooling Systems

Akasa Launches 1U Low-Profile Vapour Chamber CPU Cooler

Xiaomi and Leica Camera AG Present the Xiaomi 17 Series
Smartphones

Xiaomi and Leica Camera AG Present the Xiaomi 17 Series

Popular Reviews

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

Terramaster F8-SSD

Terramaster F8-SSD

be quiet! Light Mount Keyboard

be quiet! Light Mount Keyboard

Soundpeats Pop Clip

Soundpeats Pop Clip

Akaso 360 Action camera

Akaso 360 Action camera

Dragon Touch Digital Calendar

Dragon Touch Digital Calendar

be quiet! Pure Loop 3 280mm

be quiet! Pure Loop 3 280mm

Noctua NF-A12x25 G2 fans

Noctua NF-A12x25 G2 fans

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed