Breaking News

DJI Agras T100, T70P and T25P Launches Globally Sony Introduces the RX1R III Razer Introduces Next-Generation Connectivity and Performance with New Thunderbolt 5 Dock and Core X V2 Transcend's New ESD420 Portable SSD Offers MagSafe Compatibility and Pro-Level Performance G.SKILL Trident Z5 DDR5 Memory and WigiDash Receives European Hardware Awards 2025

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

ARM, HP and SK hynix To Participate On The Development Of Memory Cube

ARM, HP and SK hynix To Participate On The Development Of Memory Cube

PC components Jun 27,2012 0

ARM, HP, and SK hynix, Inc. have joined the global effort to accelerate widespread industry adoption of Hybrid Memory Cube (HMC) technology. The companies have joined the Hybrid Memory Cube Consortium (HMCC). Led by Micron and Samsung, the HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for the new memory technology.

Micron and Samsung are working closely with Altera, IBM, Microsoft, Open-Silicon, Xilinx and now ARM, HP and SK hynix ? to draft an industry-wide specification that should pave the way for a wide range of electronic advances.

"The strong collection of companies who have joined the consortium ? representing a broad range of technology interests ? reflects the perceived high value of HMC as the next standard for high-performance memory applications," said Robert Feurle, Micron's vice president for DRAM marketing. "With the addition of ARM, HP and SK hynix as developers, who will help to determine the specific features, the consortium is well positioned to provide a new open standard for next-gen electronics."

HMC features will enable highly efficient memory solutions for applications ranging from industrial products to high-performance computing and large-scale networking. The HMCC's team of developers plans to deliver a draft interface specification to the growing number of "adopters" joining the consortium. Then, the combined team of developers and adopters will refine the draft and release a final interface specification, currently targeted for the end of this year.

As envisioned, HMC capabilities will leap beyond current and near-term memory architectures in the areas of performance, packaging and power efficiencies, offering a major alternative to present memory technology.

One of the primary challenges facing the industry -- and a key motivation for forming the HMCC -- is that the memory bandwidth required by high-performance computers and next-generation networking equipment has increased beyond what conventional memory architectures can provide. The term "memory wall" has been used to describe this challenge. Breaking through the memory wall requires architecture such as HMC that can provide increased density and bandwidth with significantly lower power consumption.

Tags: Hybrid Memory CubeMicron Technology
Previous Post
VESA Brings DisplayPort To Mobiles, Battles With MHL
Next Post
EU court Rejects Microsofty's Antitrust Appeal, Cuts Fine

Related Posts

  • Micron Expands SSD Portfolio With New Crucial P310 2280 Gen4 SSD, Bringing High-Octane Performance To Gamers and Creators

  • Micron Unveils Industry's Fastest 2230 Gen4 Consumer SSD

  • Crucial Pro Series Supercharges Portfolio with DDR5 Overclocking Memory and World’s Fastest Gen5 SSD

  • Micron announces 9400 NVMe SSD​

  • Micron Announces Availability of “DID Agnostic” Server DRAM

  • Micron DDR5 Server DRAM Available to Data Centre Customers in Advance of Next-Generation Server Platforms

  • Phison Announces Strategic PCIe Gen5 Relationship with AMD and Micron at Computex 2022

  • Micron’s New Crucial DDR5 Memory Delivers Blazing Speeds and Massive Bandwidth to Consumers for Next-Gen Desktop PCs

Latest News

DJI Agras T100, T70P and T25P Launches Globally
Drones

DJI Agras T100, T70P and T25P Launches Globally

Sony Introduces the RX1R III
Cameras

Sony Introduces the RX1R III

Razer Introduces Next-Generation Connectivity and Performance with New Thunderbolt 5 Dock and Core X V2
Gaming

Razer Introduces Next-Generation Connectivity and Performance with New Thunderbolt 5 Dock and Core X V2

Transcend's New ESD420 Portable SSD Offers MagSafe Compatibility and Pro-Level Performance
PC components

Transcend's New ESD420 Portable SSD Offers MagSafe Compatibility and Pro-Level Performance

G.SKILL Trident Z5 DDR5 Memory and WigiDash Receives European Hardware Awards 2025
Enterprise & IT

G.SKILL Trident Z5 DDR5 Memory and WigiDash Receives European Hardware Awards 2025

Popular Reviews

be quiet! Light Loop 360mm

be quiet! Light Loop 360mm

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

be quiet! Light Mount Keyboard

be quiet! Light Mount Keyboard

Noctua NH-D15 G2

Noctua NH-D15 G2

Soundpeats Pop Clip

Soundpeats Pop Clip

be quiet! Light Base 600 LX

be quiet! Light Base 600 LX

Crucial T705 2TB NVME White

Crucial T705 2TB NVME White

be quiet! Pure Base 501

be quiet! Pure Base 501

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed