Elpida Develops Smallest 2-Gigabit DDR2 Mobile RAM
Japan's supplier of Dynamic Random Access Memory (DRAM) Elpida Memory, Inc., today announced that it had developed a 2-gigabit DDR2 Mobile RAM, the DRAM industry's smallest LPDDR2 chip.
The new DDR2 is expected to become the main product manufactured by the 40nm process line at Elpida's Hiroshima Plant.
The new 2-gigabit DDR2 Mobile RAM was developed to target the smart phone and tablet PC markets. In addition to featuring low operating voltage of 1.2V it achieves a 1066Mpbs high-speed data transfer rate and can reach 8.5GB/second for a 64-bit system configuration. Because it uses roughly 30% less operating current compared with Elpida's existing 50nm products the new Mobile RAM is an eco-friendly DRAM that contributes to extending the operating time of mobile devices.
Elpida plans to ship the new DDR2 as a bare chip for MCP and to configure it for PoP and FBGA packages. The company's FBGA packages fully leverage die-stacking technology to provide a line-up of 2-gigabit to 8-gigabit products.
Sample shipments of the new 2-gigabit DDR2 Mobile RAM will begin in August and mass production is expected to start in September of this year, Elpida said.
Features
Model: ECB240ABBCN (bare chip)
Manufacturing process: 40nm CMOS
Memory density: 2-gigabit
Data width: x16-bit / x32-bit
Per pin data transfer rate: 1066Mbps (Max.)
Supply voltage:
VDD2/VDDQ: 1.2V
VDD1: 1.8V
Operating temperature range 30 to 85°C
Shipment configuration: Bare chip, PoP-type FBGA, 134-ball FBGA (10mm x 11.5mm)
The new 2-gigabit DDR2 Mobile RAM was developed to target the smart phone and tablet PC markets. In addition to featuring low operating voltage of 1.2V it achieves a 1066Mpbs high-speed data transfer rate and can reach 8.5GB/second for a 64-bit system configuration. Because it uses roughly 30% less operating current compared with Elpida's existing 50nm products the new Mobile RAM is an eco-friendly DRAM that contributes to extending the operating time of mobile devices.
Elpida plans to ship the new DDR2 as a bare chip for MCP and to configure it for PoP and FBGA packages. The company's FBGA packages fully leverage die-stacking technology to provide a line-up of 2-gigabit to 8-gigabit products.
Sample shipments of the new 2-gigabit DDR2 Mobile RAM will begin in August and mass production is expected to start in September of this year, Elpida said.
Features
Model: ECB240ABBCN (bare chip)
Manufacturing process: 40nm CMOS
Memory density: 2-gigabit
Data width: x16-bit / x32-bit
Per pin data transfer rate: 1066Mbps (Max.)
Supply voltage:
VDD2/VDDQ: 1.2V
VDD1: 1.8V
Operating temperature range 30 to 85°C
Shipment configuration: Bare chip, PoP-type FBGA, 134-ball FBGA (10mm x 11.5mm)