Elpida will mass produce the 30nm process DRAM at its Hiroshima Plant as well as at Taiwan-based Rexchip Electronics Corporation.
Mass production of 30nm 2-gigabit DDR3 SDRAM for PC applications will start in May 2011, followed by 4-gigabit DDR2 Mobile RAM and 4-gigabit DDR3 SDRAM, the company said. Elpida's Hiroshima Plant will devote 20% of its production capacity to manufacturing the new 30nm process DRAM in the second quarter of CY 2011, which will be ramped up to 30% in the third quarter as the company implements its planned switchover of almost all production lines to cost-effective 30nm and 40nm processes.
Rexchip Electronics will start manufacturing 30nm process DRAM in the third quarter of CY 2011, with its 30nm lines reaching a production capacity of 50% in that quarter, and possibly reach 100% in the fourth quarter.
Elpida's claims tht its 30nm process DRAM yields 45% more chips per wafer than 40nm products and consumes at least 20% less power. With one of the smallest chip sizes and great power performance, 30nm process DRAM helps slash the size and power consumption of a wide range of digital electronics devices, from lightweight battery-powered mobile devices such as smartphones and tablets, to computers and servers demanding lower power consumption.