The collaborative effort will bring together Fujitsu Microelectronics IC design technologies, imaging and communication intellectual property (IP), and quality technical support to customers, especially in Japan, with TSMCs foundry-leading process technology and capability. This advanced technology engagement should enable both companies to create new business for themselves and for their prospective customers.
The two companies also announced that they intend to initiate discussions on collaborative development of high-performance process technologies for 28-nanometer and below for Fujitsu Microelectronics product applications.
"From the aspect of its advanced process technologies and large-scale production capacity, TSMC is the most attractive semiconductor foundry partner", said Haruki Okada, president of Fujitsu Microelectronics Limited. "By continuing to create our advantages in fine-pitch process technologies through this partnership, we can further grow our ASIC and ASSP product businesses."
"Fujitsu Microelectronics is clearly a world-class leader in advanced high-speed and low-power technologies, design engineering, and differentiated IP. Given TSMC's long-standing commitment to Japan's semiconductor market, and our on-going investment and dedication to advanced process technology, our collaboration with Fujitsu Microelectronics represents a new best-in-class solution for many system companies," said Dr. Rick Tsai, president & CEO of TSMC.