IBM, Samsung and GLOBALFOUNDRIES To Talk About Leading-Edge Manufacturing Solutions in Forum
IBM, Samsung Electronics and GLOBALFOUNDRIES today announced the 2011 Common Platform Technology Forum will be held Tuesday,
January 18, 2011 at the Santa Clara Convention Center in
California?s Silicon Valley.
This free, daylong event will feature the Common Platform's
collaboration to deliver semiconductor manufacturing solutions
that address the challenges of the 32/28nm technology generation
and beyond.
At this year;s event, the companies will reveal the latest details of the delivery of 32/28nm low-power high-k metal gate (HKMG) process technology, which is optimized for the next generation of smart mobile devices. The event also will feature proven design and manufacturing solutions from the alliance and its partners, as well as the Common Platform?s technology roadmap covering 20nm and beyond.
"As we move to 32/28nm and beyond, the challenges facing our industry are growing exponentially and the need for collaboration is more critical than ever," said Michael Cadigan, general manager of IBM Microelectronics, on behalf of the Common Platform alliance. "By collaborating to align our technology and manufacturing capabilities, the members of the Common Platform alliance can provide customers with maximum flexibility in foundry selection at the leading edge. At this year's event we will demonstrate our commitment to delivering an industry-leading 32/28nm technology that breaks new ground in performance and power efficiency, while driving innovation to be ready for the next generation."
The Common Platform Technology Forum will feature keynotes from industry leaders and presentations from senior members of the Common Platform partners? management and technical teams. A key part of the forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, back-end and design services companies.
To register, please visit: http://www.commonplatform.com/tf2011/02/.
At this year;s event, the companies will reveal the latest details of the delivery of 32/28nm low-power high-k metal gate (HKMG) process technology, which is optimized for the next generation of smart mobile devices. The event also will feature proven design and manufacturing solutions from the alliance and its partners, as well as the Common Platform?s technology roadmap covering 20nm and beyond.
"As we move to 32/28nm and beyond, the challenges facing our industry are growing exponentially and the need for collaboration is more critical than ever," said Michael Cadigan, general manager of IBM Microelectronics, on behalf of the Common Platform alliance. "By collaborating to align our technology and manufacturing capabilities, the members of the Common Platform alliance can provide customers with maximum flexibility in foundry selection at the leading edge. At this year's event we will demonstrate our commitment to delivering an industry-leading 32/28nm technology that breaks new ground in performance and power efficiency, while driving innovation to be ready for the next generation."
The Common Platform Technology Forum will feature keynotes from industry leaders and presentations from senior members of the Common Platform partners? management and technical teams. A key part of the forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, back-end and design services companies.
To register, please visit: http://www.commonplatform.com/tf2011/02/.
