MediaTek’s 8K DTV SoC in Volume Production on TSMC 12FFC Technology
MediaTek and TSMC announced that the first 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC.
Built on TSMC’s low-power 12nm FinFET Compact (12FFC) process following the companies’ close collaboration, the S900 will power the next generation of smart TVs.
The S900 is MediaTek’s first flagship smart TV SoC, supporting 8K resolution and high-speed edge AI computation. The integrated S900 supports features including AI voice-user interface and picture quality enhancements.
TSMC’s ultra-low power 12FFC process leads the foundry segment’s 16/14nm generation technologies in reducing die size and power consumption, which is essential for digital TV applications.
MediaTek’s S900 8K smart TV SoC integrates a proprietary AI processor unit enabling AI picture quality (AI PQ) and MiraVision-Pro, supporting a variety of AI features for smart TVs, including facial recognition and AI scene recognition enabling S900-powered TVs to fundamentally improve picture quality by optimizing color saturation, brightness, sharpness, and dynamic motion compensation. Powered by AI, the MediaTek S900 enables televisions to serve as a control hub for an AIoT ecosystem with MediaTek’s NeuroPilot AI development platform, which enables control of smart devices in the living room, kitchen, bedroom and more through voice or gesture control.
In addition to 12FFC, TSMC’s processes include 55nm ULP, 40nm ULP, 28nm ULP, and 22nm ULP/Ultra-low leakage (ULL), which have been widely adopted by various IoT and wearable applications.