NXP and TSMC Deliver First 45nm Single-Chip Digital TV Platform
NXP Semiconductors and Taiwan Semiconductor Manufacturing Company, Ltd. today announced their cooperation to deliver the first single-chip 45nm global LCD TV platform, TV550.
Featuring NXPs PNX85500 processor, built on TSMCs 45nm Low Power (LP) process technology, the NXP TV550 digital TV platform is a production-ready reference design that reduces time-to-market with a major step forward in functional integration for system cost down. The newly introduced DTV platform allows TV viewers to enjoy HD digital content and internet access with high picture quality.
NXP called on TSMC, who had announced the industrys first 45nm process technology in 2007. NXP selected TSMCs 45LP process technology for its performance characteristics such as multiple Vt to achieve lower power consumption, excellent current drive capability and one of the industrys smallest SRAM cell size of 0.299΅m2.
"Digital switchover and high definition content are the major demands for the TV industry" said Lou Schreurs, business line TV general manager, NXP Semiconductors. "With TSMCs valuable experience in advanced CMOS technologies and NXPs TV system design expertise, we are able to deliver these high end features with a reduced bill-of-materials. Our customers are highly impressed with TV550s superb picture quality and its capability to handle the complex global digital standards with a single platform."
The TSMC 45 LP cost-competitive process offers designers up to twice the density of 65nm with significant low power and up to 40% smaller die size. Compared with TSMC 40G technology, the 45LP requires less photo masks and is ideal for products demanding excellent cost performance ratio.
NXP is already delivering the engineering samples to its customers.
NXP called on TSMC, who had announced the industrys first 45nm process technology in 2007. NXP selected TSMCs 45LP process technology for its performance characteristics such as multiple Vt to achieve lower power consumption, excellent current drive capability and one of the industrys smallest SRAM cell size of 0.299΅m2.
"Digital switchover and high definition content are the major demands for the TV industry" said Lou Schreurs, business line TV general manager, NXP Semiconductors. "With TSMCs valuable experience in advanced CMOS technologies and NXPs TV system design expertise, we are able to deliver these high end features with a reduced bill-of-materials. Our customers are highly impressed with TV550s superb picture quality and its capability to handle the complex global digital standards with a single platform."
The TSMC 45 LP cost-competitive process offers designers up to twice the density of 65nm with significant low power and up to 40% smaller die size. Compared with TSMC 40G technology, the 45LP requires less photo masks and is ideal for products demanding excellent cost performance ratio.
NXP is already delivering the engineering samples to its customers.
