Samsung Introduces 10nm eMMC Memory For Slim Smartphones and Tablets
Samsung today announced a next-generation 64GB embedded multimedia card (eMMC) using 10nm-class process technology. The new 64Gb NAND memory went into production late last month.
Embedded memory is the key memory component in popular mobile applications such as smartphones and tablets.
Samsung is applying 64Gb high-performance NAND memory using its 10nm-class technology to the new 64GB eMMC Pro Class 2000 memory solution. The new solution exceeds the performance levels of the conventional 64GB eMMC Pro Class 1500 based on an eMMC 4.5 interface.
The memory has a random write speed of 2,000 IOPS (input/output per second) and a random read speed of 5,000 IOPS. In addition, sequential read and write speeds are 260 megabytes per second (MB/s) and 50MB/s respectively, which is up to 10 times faster than a class 10 external memory card that reads at 24MB/s and writes at 12MB/s, greatly enhancing the smoothness of multitasking on mobile gadgets.
Myungho Kim, vice president of Memory marketing, Device Solutions, Samsung Electronics noted, "The new high-speed, small form factor eMMC reinforces Samsung's technology leadership in storage memory solutions. We look forward to expanding our line-up of embedded memory solutions in conjunction with the new chip?s design, in pursuing a system-level adoption of application processors and other key components that form the foundation for the most advanced mobile platforms. This will allow us to better attend to time-to-market demands enabling the design of more convenient features for next-generation mobile applications."
The new high-speed eMMC will be submitted next year to the industry standards body JEDEC, (Joint Electron Engineering Council) for adoption as an industry standard.
Samsung's 64GB eMMC Pro Class 2000 comes just five months after the company introduced its first embedded memory supporting the eMMC4.5 interface and delivers a 30 percent advantage in performance over that solution.
The 10nm-class technology based NAND also is process compatible to Samsung?s 20nm-class 64Gb MLC NAND, which was first available last May, improving manufacturing productivity by 30 percent.
Current mobile applications show a distinctive trend to slimmer designs and larger display screens, while using advanced multi-core processors and high density (2 Gigabyte) LPDDR2 memory for higher performance, with larger batteries for longer usage on a single charge. This new chip accommodates the increasing size limitations of mobile form factors at the component level.
The 64GB eMMC Pro Class 2000 measures 11.5mm by 13mm, which represents a 20 percent reduction in size over the conventional embedded memory form factor (12mm by 16mm).
In related news, Samsung decided to slow down the pace of NAND flash plant construction being underway in Xi'an, Shaanxi province, China.
Samsung is said to review its overall investment plan of the Xi'an plant construction based on the judgment that there is no urgent need invest in the chip production expansion, according to sources in Samsung and the electronic industry Tuesday.
The Xi'an facility was initially expected to become fully operational by the end of 2013 and begin mass production starting in the first quarter of 2014.
Samsung is applying 64Gb high-performance NAND memory using its 10nm-class technology to the new 64GB eMMC Pro Class 2000 memory solution. The new solution exceeds the performance levels of the conventional 64GB eMMC Pro Class 1500 based on an eMMC 4.5 interface.
The memory has a random write speed of 2,000 IOPS (input/output per second) and a random read speed of 5,000 IOPS. In addition, sequential read and write speeds are 260 megabytes per second (MB/s) and 50MB/s respectively, which is up to 10 times faster than a class 10 external memory card that reads at 24MB/s and writes at 12MB/s, greatly enhancing the smoothness of multitasking on mobile gadgets.
Myungho Kim, vice president of Memory marketing, Device Solutions, Samsung Electronics noted, "The new high-speed, small form factor eMMC reinforces Samsung's technology leadership in storage memory solutions. We look forward to expanding our line-up of embedded memory solutions in conjunction with the new chip?s design, in pursuing a system-level adoption of application processors and other key components that form the foundation for the most advanced mobile platforms. This will allow us to better attend to time-to-market demands enabling the design of more convenient features for next-generation mobile applications."
The new high-speed eMMC will be submitted next year to the industry standards body JEDEC, (Joint Electron Engineering Council) for adoption as an industry standard.
Samsung's 64GB eMMC Pro Class 2000 comes just five months after the company introduced its first embedded memory supporting the eMMC4.5 interface and delivers a 30 percent advantage in performance over that solution.
The 10nm-class technology based NAND also is process compatible to Samsung?s 20nm-class 64Gb MLC NAND, which was first available last May, improving manufacturing productivity by 30 percent.
Current mobile applications show a distinctive trend to slimmer designs and larger display screens, while using advanced multi-core processors and high density (2 Gigabyte) LPDDR2 memory for higher performance, with larger batteries for longer usage on a single charge. This new chip accommodates the increasing size limitations of mobile form factors at the component level.
The 64GB eMMC Pro Class 2000 measures 11.5mm by 13mm, which represents a 20 percent reduction in size over the conventional embedded memory form factor (12mm by 16mm).
In related news, Samsung decided to slow down the pace of NAND flash plant construction being underway in Xi'an, Shaanxi province, China.
Samsung is said to review its overall investment plan of the Xi'an plant construction based on the judgment that there is no urgent need invest in the chip production expansion, according to sources in Samsung and the electronic industry Tuesday.
The Xi'an facility was initially expected to become fully operational by the end of 2013 and begin mass production starting in the first quarter of 2014.
