Akita Elpida Memory, Inc. said it has developed the world's thinnest Multi Chip Package (MCP) with 20 stacked dies. To achieve 30 ΅m thick chips the company used grinding technology and developed handling technology for such thin die. Akita Elpida also developed 40-micron low-loop wire-bonding technology and the means to inject resin into narrow gap.

Akita Elpida said it plans from now on to put this package technology to work to establish high-yield and low-cost manufacturing technology for multi-chip stacked packages such as existing 5- and 7-die multi-chip stacked packages.

Akita Elpida was created in July 2006 by DRAM maker Elpida Memory Inc. with a business scope focusing on semiconductor back-end processes.