Samsung Electronics has begun mass production of the Exynos 7 Dual 7270, a mobile application processor (AP) designed for wearable devices with 14-nanometer (nm) FinFET process technology and an LTE modem. Powered by two Cortex-A53 cores, the Exynos 7270 makes full use of the 14nm process, delivering 20 percent improvement in power efficiency when compared to its predecessor built on 28nm, and thus notably extending the battery life. By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM (frequency modulation) radio, and location-based services with GNSS (global navigation satellite system) solutions.

As well as the implementation of the 14nm FinFET process, Samsung’s packaging technology, SiP (system-in-package)-ePoP (embedded package-on-package), enables the Exynos 7270 to feature performance and energy-efficiency within a compact solution. The technology combines the AP, DRAM and NAND flash memory chips as well as the PMIC (power management IC) together into a single package. The solution can offer more features than its predecessor in the same 100-square-millimeter (mm2) area while reducing the height by approximately 30 percent.

For easier development, Samsug is offering a reference platform comprised of the Exynos 7270, NFC (near field communication) and various sensors.