GLOBALFOUNDRIES Dresden Fab Ships 250,000th 32nm HKMG Wafer
GLOBALFOUNDRIES announced that its Fab 1 in Dresden,
Germany has shipped a quarter of a million semiconductor
wafers based on 32nm High-k Metal Gate (HKMG) technology.
According to the company, on a unit basis, cumulative 32nm
shipments for the first five quarters of wafer production
are more than double that achieved during the same period
of the 45nm technology ramp, demonstrating that the
overall 32nm ramp has significantly outpaced the 45nm
ramp, despite the integration of a number of new and
complex elements in both design and process technologies.
"AMD and GLOBALFOUNDRIES worked in close partnership during 2011, and today's announcement is a testament to the progress we have made together," said AMD president and CEO Rory Read. "In just one quarter, we were able to see more than a doubling of yields on 32nm, allowing us to exit 2011 having exceeded our 32nm product shipment requirements. Based on this successful ramp of 32nm HKMG, we are committed to moving ahead on 28nm with GLOBALFOUNDRIES."
"Early in 2011 we met significant challenges in early yield learning on 32nm HKMG," said GLOBALFOUNDRIES CEO Ajit Manocha. "However, we made several organizational and operational changes in the second half of the year that led to a dramatic increase in production velocity and major breakthroughs in yield learning. And since our 28nm technology uses the same HKMG implementation as 32nm, AMD and other customers will benefit greatly from our high-volume ramp of leading-edge APUs at 32nm."
At Fab 1 in Dresden, GLOBALFOUNDRIES recently completed construction of an additional wafer manufacturing facility designed to add capacity at 45nm and below, which has the potential to increase the overall output of the Fab 1 campus to 80,000 wafers per month once fully ramped. The expansion project is adding more than 110,000 square feet of cleanroom space to the site, making Fab 1 the largest wafer fab in Europe for leading-edge technology. More than 50 percent of Fab 1's production is now on HKMG technology. In addition to the 32nm technology, GLOBALFOUNDRIES says that its 28nm HKMG offerings are qualified and ready for design-in today.
"AMD and GLOBALFOUNDRIES worked in close partnership during 2011, and today's announcement is a testament to the progress we have made together," said AMD president and CEO Rory Read. "In just one quarter, we were able to see more than a doubling of yields on 32nm, allowing us to exit 2011 having exceeded our 32nm product shipment requirements. Based on this successful ramp of 32nm HKMG, we are committed to moving ahead on 28nm with GLOBALFOUNDRIES."
"Early in 2011 we met significant challenges in early yield learning on 32nm HKMG," said GLOBALFOUNDRIES CEO Ajit Manocha. "However, we made several organizational and operational changes in the second half of the year that led to a dramatic increase in production velocity and major breakthroughs in yield learning. And since our 28nm technology uses the same HKMG implementation as 32nm, AMD and other customers will benefit greatly from our high-volume ramp of leading-edge APUs at 32nm."
At Fab 1 in Dresden, GLOBALFOUNDRIES recently completed construction of an additional wafer manufacturing facility designed to add capacity at 45nm and below, which has the potential to increase the overall output of the Fab 1 campus to 80,000 wafers per month once fully ramped. The expansion project is adding more than 110,000 square feet of cleanroom space to the site, making Fab 1 the largest wafer fab in Europe for leading-edge technology. More than 50 percent of Fab 1's production is now on HKMG technology. In addition to the 32nm technology, GLOBALFOUNDRIES says that its 28nm HKMG offerings are qualified and ready for design-in today.
