KIOXIA Europe GmbH has announced a trio of new flash storage products in the space of two days, rounding out a refreshed lineup aimed squarely at the growing storage demands of AI — from smartphones running on-device models to hyperscale data centers powering large-scale inference. All three lines will be demonstrated at FMS: the Future of Memory and Storage, taking place 4–6 August in Santa Clara, California.

NX1 Series: liquid-cooled SSDs for hyperscale AI infrastructure
The first announcement, made 29 July, introduced the KIOXIA NX1 Series, a new generation of E1.S PCIe 5.0 NVMe data center SSDs and the company's first drive to support direct liquid cooling. The NX1 line succeeds the KIOXIA XD Series and is built around a new in-house controller architecture designed to give hyperscale operators and cloud providers more performance without sacrificing efficiency. Compared with the previous generation, KIOXIA says the new drives offer notably higher sequential write and random write performance.

The E1.S form factor — available in both 9.5 mm (liquid- and air-cooling capable) and 15 mm (air-cooling) variants — is intended to help data centers manage the intense thermal demands of increasingly accelerator-dense server designs. Capacities span 1.92 TB to 15.36 TB, with 1 DWPD endurance for read-intensive workloads, and the drives are compliant with PCIe 5.0, NVMe 2.0 and OCP Datacenter NVMe SSD 2.6 specifications.

"The KIOXIA NX1 Series is designed to enable this transition with direct liquid cooling capabilities and high-performance, power-efficient performance," said Paul Rowan, Chief Marketing Officer & Vice President at KIOXIA Europe GmbH.

The NX1 Series is currently sampling to select hyperscale customers.

CM10 Series: first PCIe 6.0 enterprise SSDs, built for AI inference
A day later, on 30 July, KIOXIA introduced the CM10 Series, its first PCIe 6.0 enterprise SSD line, built on the company's newest BiCS FLASH generation 10 TLC flash memory. Where the NX1 targets general hyperscale storage, the CM10 is pitched specifically at AI inference and context-caching workloads — the fast-growing category of storage sitting just outside GPU memory in the AI serving pipeline. The drives support NVIDIA's CMX architecture, which extends the memory hierarchy beyond GPU memory into high-performance flash.

KIOXIA reports substantial generational gains: up to 92% higher sequential read performance and roughly 85% higher random read performance versus its predecessor, the CM9 Series. Like the NX1, the CM10 supports direct-cold-plate liquid cooling, available in E3.S and E1.S 9.5 mm form factors, alongside a PCIe 5.0-compliant 2.5-inch option. Capacities range from 1.60 TB to 61.44 TB, with both read-intensive and mixed-use endurance tiers, and security options including post-quantum cryptography aligned with CNSA 2.0.

"The role of storage is expanding. SSDs are now an important part in the inferencing pipeline," said Rowan. "KIOXIA's CM10 Series is designed to support NVIDIA CMX, delivering the performance, efficiency and endurance required for these next-generation AI deployments."

The CM10 Series is currently sampling to selected customers.

UFS 5.0: bringing AI-grade speed to mobile and edge devices
Rounding out the announcements, also on 30 July, KIOXIA revealed its UFS 5.0 embedded flash memory solutions — extending the AI-storage push down to smartphones, tablets, AR/VR headsets, robotics and industrial edge devices. Built to the latest JEDEC UFS 5.0 standard and using the MIPI M-PHY v6.0 physical layer with UniPro v3.0 protocol, the new devices support theoretical interface speeds up to 46.6 Gb/s per lane, with roughly 10.8 GB/s of combined dual-lane read/write throughput.

KIOXIA frames the launch as addressing a growing bottleneck: as on-device large language models, multimodal AI and real-time inference move onto phones and edge hardware, storage read speed increasingly limits how fast those workloads can access data. The new UFS 5.0 devices pair an in-house UFS 5.0 controller with KIOXIA's BiCS FLASH generation 8 3D flash memory, delivering sequential read speeds up to 10 GB/s and sequential write speeds up to 9.0 GB/s, along with improved power efficiency, better thermal management, and a more compact 7.5 × 13 mm package than the prior generation.

"On-device AI redefines what users expect from future mobile and edge devices; manufacturers need storage solutions that keep pace with these increasing AI workloads," said Axel Störmann, VP & CTO of KIOXIA Europe GmbH. "KIOXIA UFS 5.0 delivers the speed, efficiency and capacity necessary to build these next-generation intelligent devices."

The UFS 5.0 solutions are available now as commercial samples in 512 GB and 1 TB capacities, with mass production expected by the end of 2026.

A unified push across the AI storage stack
Taken together, the three launches show KIOXIA positioning flash storage as infrastructure for AI at every layer — from the phone in a user's pocket to the liquid-cooled racks powering trillion-parameter models. All three product lines will make their public debut at FMS 2026 in Santa Clara next week.

more information at
https://europe.kioxia.com/en-europe/business/news/2026/20260730-1.html
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