Micron To Offer DDR4 Modules for Future Intel Xeon Systems
Micron Technology is ramping production of DDR4 memory to support upcoming Intel CPU launches.
The company says that its new DDR4 technology contributes to a power improvement of up to 35% compared to standard DDR3.
Micron is ramping its 4Gb-based DDR4 module production at 2133 megatransfers per second (MT/s) in support of Intel's Xeon processor E5-2600 v3 product family-based systems. Micron is also sampling a 2400 MT/s device in anticipation of follow-on products targeted for 2015.
"Our JEDEC-compliant portfolio showcases the performance and power benefits that DDR4 products can provide for our customers," said Robert Feurle, Micron's vice president of marketing and program management. "As a result of Micron's close engagement with our key enabling partners, we are well positioned to bring this exciting new technology to market."
The new Intel Xeon processor E5-2600 v3 processors are expected to hit the market in 2H'14.
Micron's fully JEDEC-compliant DDR4 portfolio includes RDIMMs, LRDIMMs, VLP RDIMMs, UDIMMs and SODIMMs (ECC and non-ECC), as well as x4, x8 and x16 components.
Micron expects to be ready to deliver NVDIMM customer samples in the early 3Q14 timeframe.
Micron is ramping its 4Gb-based DDR4 module production at 2133 megatransfers per second (MT/s) in support of Intel's Xeon processor E5-2600 v3 product family-based systems. Micron is also sampling a 2400 MT/s device in anticipation of follow-on products targeted for 2015.
"Our JEDEC-compliant portfolio showcases the performance and power benefits that DDR4 products can provide for our customers," said Robert Feurle, Micron's vice president of marketing and program management. "As a result of Micron's close engagement with our key enabling partners, we are well positioned to bring this exciting new technology to market."
The new Intel Xeon processor E5-2600 v3 processors are expected to hit the market in 2H'14.
Micron's fully JEDEC-compliant DDR4 portfolio includes RDIMMs, LRDIMMs, VLP RDIMMs, UDIMMs and SODIMMs (ECC and non-ECC), as well as x4, x8 and x16 components.
Micron expects to be ready to deliver NVDIMM customer samples in the early 3Q14 timeframe.