Nakaya Microdevices Corporation, Amkor Technology, Inc. and Toshiba Corporation today announced that they are continuing their negotiations of definitive agreements pursuant to a non-binding memorandum of understanding for the formation of a joint venture in Japan to provide system LSI assembly and testing services. The initial target date of October 1 for the start of operations will be extended and the parties plan to announce the proposed commencement date when definitive agreements are finalized. The terms of the joint venture have not yet been determined and the formation of the joint venture remains subject to the negotiation of definitive agreements.

Founded in 1970 in Oita, Japan, Nakaya Microdevices Corporation has served as an independent provider of semiconductor assembly and test for nearly 40 years.

Amkor is a provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs.