Fujitsu and TSMC to Collaborate on 28nm Process Technology
Fujitsu Microelectronics Ltd. and Taiwan Semiconductor Manufacturing Company, Ltd. announced last week that they have agreed to collaborate on 28-nanometer (nm) process technology.
Previously, both companies announced that Fujitsu Microelectronics will collaborate with TSMC on 40nm production. This will extend Fujitsu Microelectronics? 40nm collaboration with TSMC and covers joint development of an optimized 28nm process technology. Initial 28nm samples are expected to ship toward the end of 2010.
This collaborative effort combines Fujitsu Microelectronics? strength in advanced high-speed process and low-power design technologies with TSMC?s expertise in power-efficient high- performance logic/SoC process and technology platform that is part of the Open Innovation Platform from TSMC. Extending the collaboration to 28nm will provide the opportunity for both companies to capitalize on a competitive and high-performance 28nm technology based on TSMC?s 28nm technology portfolio that includes high-performance and low-power applications.
The two companies are also discussing possibilities for collaborating on advanced packaging that could include joint developments that combine Fujitsu Microelectronics? strengths in high-performance lead-free and ultra-high-pin count packaging technologies, with TSMC?s strength in chip-package integration and advanced Cu/ELK interconnect.
"We are rapidly progressing in our previously-announced collaboration with TSMC on 40nm process technology, with several product designs in progress at present," said Haruyoshi Yagi, Corporate Senior Vice President of Fujitsu Microelectronics Limited. "With this further agreement with TSMC on 28nm high-performance process technology development and production, we combine both companies? strengths to create greater value for our customers, and will further drive the growth of businesses for TSMC and Fujitsu?s ASIC and ASSP core products."
This collaborative effort combines Fujitsu Microelectronics? strength in advanced high-speed process and low-power design technologies with TSMC?s expertise in power-efficient high- performance logic/SoC process and technology platform that is part of the Open Innovation Platform from TSMC. Extending the collaboration to 28nm will provide the opportunity for both companies to capitalize on a competitive and high-performance 28nm technology based on TSMC?s 28nm technology portfolio that includes high-performance and low-power applications.
The two companies are also discussing possibilities for collaborating on advanced packaging that could include joint developments that combine Fujitsu Microelectronics? strengths in high-performance lead-free and ultra-high-pin count packaging technologies, with TSMC?s strength in chip-package integration and advanced Cu/ELK interconnect.
"We are rapidly progressing in our previously-announced collaboration with TSMC on 40nm process technology, with several product designs in progress at present," said Haruyoshi Yagi, Corporate Senior Vice President of Fujitsu Microelectronics Limited. "With this further agreement with TSMC on 28nm high-performance process technology development and production, we combine both companies? strengths to create greater value for our customers, and will further drive the growth of businesses for TSMC and Fujitsu?s ASIC and ASSP core products."
