Micron Enables Servers with Industry's First PC2-5300 FBDIMMs
Micron Technology today extended its leadership in fully buffered dual in-line memory module (FBDIMM) solutions as the first supplier to provide FBDIMMs using DDR2-667 components.
As one of the few suppliers of DDR2 memory for the industry's initial demonstration of FBDIMM technology at the Intel Developer Forum in September 2004, Micron remains the industry's primary FBDIMM memory supplier with a complete line up of modules with densities from 256 megabyte (MB) to 2 gigabyte (GB) and speed grades now extending to PC2-5300.
"To address the demands for higher system performance JEDEC and Intel jointly developed the FBDIMM specification, and Micron actively supported this important effort since its inception," said Terry Lee, Executive Director of Advanced Technology and Strategic Marketing for Micron's System Memory Group. "Micron played a critical role in leading several JEDEC task groups in the standardization effort. We are extremely pleased that Micron's DDR2 memory and FBDIMM technology solutions played such an important, leading role in the early stages of this exciting new technology."
Micron set the industry's pace early and often with DDR2 memory with numerous industry firsts, and now with its DDR2-667MHz components, the Company is again uniquely qualified to sharply raise server and workstation computing performance to unprecedented levels with its next-generation DDR2-667 component-based FBDIMMs.
"FBDIMM technology will be essential to increasing the speed and memory capacity in new server and workstation platforms beginning in 2006," said Jim Pappas, director of initiatives marketing for Intel's Enterprise Platform Group. "With a rapidly growing ecosystem of companies, such as Micron, introducing FBDIMMs, we're well on track to realizing the benefits of this innovative, high-performance memory technology."
"FBDIMM and DDR2-667 is the key technology combination for high-density, high-performance memory required in next-generation bandwidth-intensive server applications." added Lee. "These products will begin to appear in production systems in 1H06, and Micron will be ready with a full array of FBDIMM products for server, workstation, and other market segment applications."
"To address the demands for higher system performance JEDEC and Intel jointly developed the FBDIMM specification, and Micron actively supported this important effort since its inception," said Terry Lee, Executive Director of Advanced Technology and Strategic Marketing for Micron's System Memory Group. "Micron played a critical role in leading several JEDEC task groups in the standardization effort. We are extremely pleased that Micron's DDR2 memory and FBDIMM technology solutions played such an important, leading role in the early stages of this exciting new technology."
Micron set the industry's pace early and often with DDR2 memory with numerous industry firsts, and now with its DDR2-667MHz components, the Company is again uniquely qualified to sharply raise server and workstation computing performance to unprecedented levels with its next-generation DDR2-667 component-based FBDIMMs.
"FBDIMM technology will be essential to increasing the speed and memory capacity in new server and workstation platforms beginning in 2006," said Jim Pappas, director of initiatives marketing for Intel's Enterprise Platform Group. "With a rapidly growing ecosystem of companies, such as Micron, introducing FBDIMMs, we're well on track to realizing the benefits of this innovative, high-performance memory technology."
"FBDIMM and DDR2-667 is the key technology combination for high-density, high-performance memory required in next-generation bandwidth-intensive server applications." added Lee. "These products will begin to appear in production systems in 1H06, and Micron will be ready with a full array of FBDIMM products for server, workstation, and other market segment applications."
