Samsung announced the first 3-megapixel (M-pixel) CMOS image sensor (CIS) with a 1/4-inch lens aperture for ultra slim camera phones.

Samsung's new 1.75um-size pixel enables the 1/4-inch lens aperture to reduce the camera module size by 30 percent as opposed to a conventional 2.25um pixel 1/3-inch lens aperture 3M-pixel CIS. The small form factor allows the 1.75um-pixel, 1/4-inch lens aperture 3M-pixel CIS to immediately replace a 1/4-inch lens aperture 2M-pixel CIS module, as it shares the same physical measurements with the new 3M-pixel CIS.

Samsung claims that the 1.75um pixel, 1/4-inch lens aperture 3M-pixel CIS shows no degrading in the picture quality compared to a 2.25um pixel, 1/3-inch lens aperture 3M-pixel CIS.

By utilizing 90-nanometer (nm) process technology, Samsung expects to mass produce the new 1.75um pixel, 1/4-inch lens aperture 3-Mp CIS in the first quarter of 2007. The new CIS chip uses Samsung's proprietary 90nm copper technology that reduces the distance between the micro-lens to the photo diode thereby resulting in maximizing the light-gathering efficiency to overcome the potential decline of image quality as the pixel size scales down.