Breaking News

MSI Unveils MPG 274URDFW E16M Mini-LED Monitor Silicon Power Unleashes its First CUDIMM Under the New XPOWER Cyclone DDR5 Gaming Series Sony introduces WH-1000XM6 COLORFUL Unveils Latest Innovations at COMPUTEX 2025 All New Lenovo ThinkStation PGX

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

Toshiba and SanDisk Start Construction of Fab 5 for NAND 
Flash Memory

Toshiba and SanDisk Start Construction of Fab 5 for NAND Flash Memory

Enterprise & IT Jul 14,2010 0

Toshiba today announced that it has started construction of a fabrication facility (fab), Fab 5, at Yokkaichi Operations, its memory production facility in Mie Prefecture, with construction work scheduled for completion in Spring 2011. In addition, Toshiba and SanDisk have signed primary agreements for a new joint venture to operate in the Fab 5 facility.

Construction of the new fab reflects expectations for increasing demand for NAND flash memory for existing and emerging applications, such as smartphones and solid-state drives. Adding new production capacity will ensure that Toshiba and SanDisk are able to respond quickly to market expansion.

The fab building will be constructed in two phases, with the pace of investment reflecting market trends. On completion of its second phase, Fab 5 will be comparable to Fab 4, with a ground area of some 38,000m2. The partners have flexibility as to the extent and timing of their respective fab capacity ramps, and the output allocation will be in accordance with the proportionate level of equipment funding. The initial manufacturing process will be the leading-edge 20-nanometer generation, with subsequent generations to follow.

Fab 5 will have a quake-absorbing structure and is designed to impose minimal environmental impacts. Extensive use of LED lighting throughout the facility, energy-saving manufacturing equipment, and use of inverter-controlled pumps for semiconductor production equipment are expected to cut CO2 emissions to a level 12% lower than for Fab 4.

Yokkaichi Operations currently has four NAND flash memory fabs. Toshiba and SanDisk are currently ramping into the unused clean room space in Fab 4, and expect to reach full capacity of Fab 4 by the start of production in Fab 5.



Outline of Fab 5

Structure of building: 2-Story steel frame concrete, five floors
Ground area: Approximately 38,000m2
Total floor area: Approximately 187,000m2
Construction start: July 2010
Completion of first phase: Spring 2011 (Planned)

Outline of Yokkaichi Operations

Location: 800, Yamanoisshiki-cho, Yokkaichi, Mie Prefecture
Established: January 1992
General Manager: Koji Sato
Employees: Approximately 4,300
(as of end of March, 2010, regular employees only for Toshiba)
Site area: Approximately 436,800 m2 (including Fab 5)
Total floor area: Approximately 647,000m2 (including Fab 5)

Tags: ToshibaSanDisknand
Previous Post
Renesas Introduces Energy Efficient USB 3.0 Host Controller
Next Post
Sony Debuts First Consumer Interchangable Lens HD Camcorder

Related Posts

  • Toshiba expands storage evaluation services in EMEA with new HDD Innovation Lab

  • KIOXIA and Sandisk unveil next-generation 3D flash memory technology achieving 4.8Gb/s NAND interface speed

  • Toshiba Unveils New Canvio Flex and Canvio Gaming 2.5” Portable Hard Drives

  • WD at CES 2025

  • Toshiba Collaborates with PROMISE Technology on Providing the Optimal Data Storage Technology for CERN’s Large Hadron Collider

  • Toshiba Announces 24TB CMR and 28TB SMR Enterprise Hard Disk Drives

  • Toshiba Canvio Flex 4TB

  • Toshiba Canvio Basics 1TB

Latest News

MSI Unveils MPG 274URDFW E16M Mini-LED Monitor
Gaming

MSI Unveils MPG 274URDFW E16M Mini-LED Monitor

Silicon Power Unleashes its First CUDIMM Under the New XPOWER Cyclone DDR5 Gaming Series
PC components

Silicon Power Unleashes its First CUDIMM Under the New XPOWER Cyclone DDR5 Gaming Series

Sony introduces WH-1000XM6
Consumer Electronics

Sony introduces WH-1000XM6

COLORFUL Unveils Latest Innovations at COMPUTEX 2025
PC components

COLORFUL Unveils Latest Innovations at COMPUTEX 2025

All New Lenovo ThinkStation PGX
Enterprise & IT

All New Lenovo ThinkStation PGX

Popular Reviews

be quiet! Light Loop 360mm

be quiet! Light Loop 360mm

be quiet! Dark Rock 5

be quiet! Dark Rock 5

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

G.skill Trident Z5 Neo RGB DDR5-6000 64GB CL30

G.skill Trident Z5 Neo RGB DDR5-6000 64GB CL30

Arctic Liquid Freezer III 420 - 360

Arctic Liquid Freezer III 420 - 360

Crucial Pro OC 32GB DDR5-6000 CL36 White

Crucial Pro OC 32GB DDR5-6000 CL36 White

Crucial T705 2TB NVME White

Crucial T705 2TB NVME White

be quiet! Light Base 600 LX

be quiet! Light Base 600 LX

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed