Toshiba today announced the next generation of its HG series of high performance solid state drives (SSDs) - the HG6 SSD series. The HG6 series is available in a variety of standard form factors including 2.5-inch (7mm/9.5mm heights) and thin, space-saving mSATA2 and M.2, and is available in capacities of up to 512GB. They come with 6Gbit/s SATA interface speeds and are optimized for notebook PCs, workstations, thin clients, server boot drives, and read-intensive enterprise applications.

Toshiba quotes a sequential read (max) speed of 534 MB/s and sequential write of 482 MB/s, for the 2.5-inch 512 GB model.

The HG6 series incorporates Toshiba's proprietary QSBC (Quadruple Swing-By Code) error-correction technology, an efficient error correction code (ECC), which helps protect customer data from corruption caused by NAND wear, thus improving the reliability of and extending the usable life of the SSD. The series also includes end-to-end data path protection and a self-encrypting feature option that is compliant with Trusted Computing Group (TCG) Opal 2.0, the TCG specification for self-encrypting drive function. This is the first mainstream SSD product to use Toshiba A19nm Toggle 2.0 MLC NAND media.

Toshiba will start shipping the HG6 series in March 2014.

Form Factor	2.5-inch Case (9.5 mmH)	2.5-inch Case (7.0 mmH)	mSATA Module	M.2. 2280 (Double-Sided)	M.2. 2280 (Single-Sided)
Connector Type	Standard SATA	Standard SATA	mSATA	M.2 B-M	M.2 B-M
Model Number	THNSxJyyyGBSU	THNSxJyyyGCSU	THNSxJyyyGMCU	THNSxJyyyG8NU/DNU	THNSxJyyyGVNU
Capacity	60/128/256/512 GB		60/128/256/512 GB	60/128/256/512 GB	128/256 GB
Memory	TOSHIBA A19 nm MLC NAND Flash Memory
Interface	ACS-2, SATA revision 3.1 1.5/3/6 Gbit/s
Performance	Sequential Read (max): 534 MB/s{510 MiB/s} (2.5-inch 512 GB Model) Sequential Write (max): 482 MB/s{460 MiB/s} (2.5-inch 512 GB Model)
Supply Voltage	5.0 V ±5 %		3.3 V ±5 %	3.3 V ±5 %	3.3 V ±5 %
Power Consumption (Largest capacity Model)	Active: 3.3 W typ. Idle: 125 mW typ.		Active: 3.2 W typ. Idle: 65 mW typ.	Active:3.2 W typ. Idle: 65 mW typ.	Active: 2.5 W typ. Idle: 65 mW typ.
Temperature	Operating: 0 °C - 70 °C (case temperature) Non-operating: -40 °C ? 85 °C		Operating: 0 °C - 80 °C (components temperature) Non-operating: -40 °C ? 85 °C	Operating: 0 °C - 80 °C (components temperature) Non-operating: -40 °C ? 85 °C	Operating: 0 °C - 80 °C (components temperature) Non-operating: -40 °C ? 85 °C
Shock	14.7 km/s2 {1500 G} at 0.5 ms
Vibration	Operating / Non-operating: 196 m/s2 {20 G} at 10-2,000 Hz
Reliability	Mean Time to Failure (MTTF): 1,500,000 hours
Size	100.0 mm x 69.85 mm x 9.5 mm	100.0 mm x 69.85 mm x 7.0 mm	50.95 mm x 30.0 mm x 3.95 mm	80.0 mm x 22.0 mm x 3.50 mm	80.0 mm x 22.0 mm x 2.15 mm
Weight	51-55 g typ.	49-53 g typ.	7.3-7.7 g typ.	7.0-9.3 g typ.	6.4-6.6 g typ.
More Features	・ Translation mode which enables any drive configuration ・ 28-bit LBA mode commands and 48-bit LBA mode commands support ・ Multi word DMA, Ultra-DMA, Advanced PIO mode ・ Automatic retries and corrections for read errors ・ SED models are based on TCG OPAL version 2.0. SED models supports Wipe Technology.