Foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have reported sequential increases in March consolidated revenues of 21.5% and 7.1%, respectively.
On a consolidated basis, TSMC's revenues for March 2020 were approximately NT$113.52 billion, an increase of 21.5 percent from February 2020 and an increase of 42.4 percent from March 2019. The company's revenues for January through March 2020 totaled NT$310.60 billion, an increase of 42.0 percent compared to the same period in 2019.
TSMC has reportedly seen a substantial increase in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, according to the report from DigiTimes.
CoWoS is a multi-chip packaging technology that allows for dies to be placed side by side on interposer that is providing high interconnect density and performance. NVIDIA's P100 and V100 dies that integrate logic and HBM memory on a single die have been using CoWoS.
TSMC's upgraded CoWoS technology allows new parts to scale far larger than the first-generation implementation - up to 1700 squared millimeters of die space.
UMC posted revenues for March 2020 climbed 41.1% from a year earlier to NT$14.57 billion. Revenues for the first quarter amounted to NT$42.27 billion, up 29.7% on year.
TSMC will disclose other financial data for the first quarter as well as business outlook at its upcoming investors meeting scheduled for April 16, while UMC will hold its quarterly investors conference on April 27.