Breaking News

Viltrox Announces AF 15mm F1.7 Air MSI Prestige 16 AI Mercedes-AMG Motorsport Limited Edition Laptop GAMEMAX Introduces AERIS 330 Series micro-ATX PC Case COLORFUL Launches Rimbook Series Laptops Circular Smart Rings Offer Early Detection of Sickness Symptoms

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

Samsung Readies  Memory With Advanced Chip Stacking Technology

Samsung Readies Memory With Advanced Chip Stacking Technology

PC components Dec 7,2010 0

Samsung Electronics today announced the development of an eight gigabyte (GB) registered dual inline memory module (RDIMM) based on its Green DDR3 DRAM. The new memory module, which has just been successfully tested by major Samsung customers, delivers high performance, in particular because of its use of a three-dimensional (3D) chip stacking technology referred to as 'through silicon via' (TSV).

"At Samsung, we're well positioned to accommodate early market demand for our state-of-the-art TSV technology as the industry continues to forge forward with even further advances in bonding technology to enable greater performance and operational efficiency," said Dr. Chang-Hyun Kim, senior vice president and Samsung fellow, memory product planning & application engineering at Samsung Electronics. "Our 40nm-class RDIMM being announced today marks the introduction of a more advanced eco-friendly 'Green Memory' product line up utilizing 3D-TSV technology that is expected to enhance the leadership of Samsung and our allies in server and enterprise storage."

An 8GB RDIMM utilizing Samsung's 3D TSV technology saves up to 40 percent of the power consumed by a conventional RDIMM. Also, the TSV technology allows for an improvement in memory chip density that is expected to offset the decrease of memory sockets in next generation server systems. In the face of a 30 percent decrease in memory slots in next-generation servers, the TSV technology will be able to raise the DRAM density by more than 50 percent, making it highly attractive for high-density, high-performance server systems.

Samsung's TSV technology is a key to solving the paradox of driving lower power consumption in servers, while increasing memory capacity and improving performance.

The TSV technology fabricates micron-sized holes through the silicon vertically, with a copper filling. By using the - through silicon via - bonding process instead of conventional wire bonding, signal lines are shortened significantly, enabling the multi-stacked chip to function at levels comparable to a single silicon chip.

Already passing customer performance tests, Samsung is readying its TSV technology for a variety of server applications having stringent performance and power demands.

Samsung plans to apply the higher performance and lower power features of its TSV technology to 30nm-class and finer process nodes.

Tags: SAMSUNGDDR3
Previous Post
New Alliance Debuts With Open Security Standard to Foster Next-Generation Transit Fare Collection
Next Post
AMD Introduces Faster Six-core and Dual-core Processors

Related Posts

  • Galaxy AI Is Coming to New Galaxy Watch for More Motivational Health

  • Samsung Introduces Galaxy A55 5G and Galaxy A35 5G

  • Samsung’s New AI PC, Galaxy Book4 Series, Available Globally Beginning February 26

  • Samsung and Google Cloud Join Forces to Bring Generative AI to Samsung Galaxy S24 Series

  • Samsung Galaxy S24 Ultra Creates New Standards of Durability and Visual Clarity With Corning® Gorilla® Armor

  • Samsung announces 2024 Neo QLED, MICRO LED, OLED

  • Samsung Electronics Expands Odyssey Gaming Monitor Lineup With New OLED Models at CES 2024

  • Samsung Adds More Devices to Its Self-Repair Program, Including Foldables for the First Time

Latest News

Viltrox Announces AF 15mm F1.7 Air
Cameras

Viltrox Announces AF 15mm F1.7 Air

MSI Prestige 16 AI Mercedes-AMG Motorsport Limited Edition Laptop
Consumer Electronics

MSI Prestige 16 AI Mercedes-AMG Motorsport Limited Edition Laptop

GAMEMAX Introduces AERIS 330 Series micro-ATX PC Case
Cooling Systems

GAMEMAX Introduces AERIS 330 Series micro-ATX PC Case

COLORFUL Launches Rimbook Series Laptops
Enterprise & IT

COLORFUL Launches Rimbook Series Laptops

Circular Smart Rings Offer Early Detection of Sickness Symptoms
Consumer Electronics

Circular Smart Rings Offer Early Detection of Sickness Symptoms

Popular Reviews

be quiet! Light Loop 360mm

be quiet! Light Loop 360mm

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

be quiet! Light Mount Keyboard

be quiet! Light Mount Keyboard

Noctua NH-D15 G2

Noctua NH-D15 G2

Soundpeats Pop Clip

Soundpeats Pop Clip

be quiet! Light Base 600 LX

be quiet! Light Base 600 LX

be quiet! Pure Base 501

be quiet! Pure Base 501

Terramaster F8-SSD

Terramaster F8-SSD

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed