Breaking News

DZOFILM Expands Arles Cine Lens System With 25–75mm and 65–180mm T2.6 Zooms G.SKILL Launches Trident Z5 Royal NeoX Series DDR5 Memory with AMD EXPO Technology XERON Launches NEX A61 ARGB CPU Air Cooler Viltrox to Unveil New Lenses And Production Solutions at IBC2026 ASUS Announces WiFi 8 Router

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed

Search form

Chinese Tsinghua Unigroup Aims At Chip Giants With Strong Investment Plan

Chinese Tsinghua Unigroup Aims At Chip Giants With Strong Investment Plan

Enterprise & IT Nov 16,2015 0

China's Tsinghua Unigroup plans to invest 300 billion yuan ($47 billion) over the next five years in a bid to become the world's third-biggest chipmaker, the chairman of the state-backed technology conglomerate said on Monday. Speaking to Reuters, chairman Zhao Weiguo said that the company controlled by Tsinghua University was in talks with a U.S.-based company involved in the chip industry. A deal could be finalised as early as the end of this month, he said.

Currently, Qualcomm holds the No.3 position in the global chip rankings, behind Samsung Electronicsand market leader Intel.

Tsinghua Unigroup has spent more than $9.4 billion making acquisitions and investments at home and abroad over the past two years, including the purchase of stakes in U.S. data storage company Western Digital and Taiwan's Powertech Technology.

In August, it made an informal $23 billion takeover offer for U.S. giant Micron Technology that was rejected out-of-hand by the Idaho-based chipmaker amid concerns a deal might endanger national security.

Tags: Tsinghua Unigroup
Previous Post
ISSCC To Highlight Future Chip Advancements
Next Post
TDK Launches CAS1B Series of SATA CFast Card Type SSDs

Related Posts

  • China's ChangXin Memory Technologies Increases DRAM Production

  • Process Technology Remains the Biggest Challenge to DRAM Production in China

  • Chinese Yangtze Memory Begins Mass-production of 64-layer 3D NAND Flash Memory

  • China's Tsinghua Unigroup Forms DRAM Chip Unit

  • Intel Said to End 5G modem Alliance with Tsinghua Unigroup's Unisoc

  • China's Pushes into Semiconductor Market

  • Intel Eyes China Partnerships As Flash Memory Pact With Micron Ends

  • Tsinghua Unigroup May License 3D NAND flash Technology From Intel

Latest News

DZOFILM Expands Arles Cine Lens System With 25–75mm and 65–180mm T2.6 Zooms
Cameras

DZOFILM Expands Arles Cine Lens System With 25–75mm and 65–180mm T2.6 Zooms

G.SKILL Launches Trident Z5 Royal NeoX Series DDR5 Memory with AMD EXPO Technology
PC components

G.SKILL Launches Trident Z5 Royal NeoX Series DDR5 Memory with AMD EXPO Technology

XERON Launches NEX A61 ARGB CPU Air Cooler
Cooling Systems

XERON Launches NEX A61 ARGB CPU Air Cooler

Viltrox to Unveil New Lenses And Production Solutions at IBC2026
Cameras

Viltrox to Unveil New Lenses And Production Solutions at IBC2026

ASUS Announces WiFi 8 Router
Enterprise & IT

ASUS Announces WiFi 8 Router

Popular Reviews

Endorfy Thock V2 Wireless Keyboard

Endorfy Thock V2 Wireless Keyboard

The Quiet Technology Behind the Spin

The Quiet Technology Behind the Spin

SoundPeats Cove Pro

SoundPeats Cove Pro

Akaso Brave 8 Lite

Akaso Brave 8 Lite

Kioxia Exceria Plus G3 512GB microSD

Kioxia Exceria Plus G3 512GB microSD

be quiet! Dark Perk Mice

be quiet! Dark Perk Mice

SoundPeats C30

SoundPeats C30

XbotGo Chamaleon

XbotGo Chamaleon

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed