Toshiba is launching the JEDEC e·MMCTM Version 5.1 compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 requirements.
The line-up offers densities of 8GB, 16GB, 32GB and 64GB. Sample shipments start from today with mass production scheduled for the second quarter (April to June) of 2017.
The new products integrate NAND chips fabricated with 15nm process technology with a controller to manage basic control functions for NAND applications in a single package. As a complement to Toshiba's previous product group of e·MMC, which deliver the operating temperature range of -40 to +85°C required by car infotainment applications, the new products support applications such as instrument clusters that require e·MMC storage solutions to operate at higher temperatures up to +105°C.
Toshiba is also developing automotive UFS products that support AEC-Q100.
- Interface: JEDEC e·MMC V5.1 standard HS-MMC interface
- Capacity: 8GB, 16GB, 32GB, 64GB
- Power Supply Voltage:
- 2.7-3.6V (Memory core)
- 1.7V-1.95V, 2.7V-3.6V (Interface)
- Bus Width: x1, x4, x8
- Temperature Range: -40oC to +105oC
- 153Ball FBGA
- 11.5mm x 13.0mm