Toshiba Expands Line-up of eMMC Version 5.1 Embedded NAND Flash Memory Products
Toshiba is launching the JEDEC eMMCTM Version 5.1compliant embedded NAND flash memory products supporting "command queuing" and "secure write protection".
The new products integrate NAND chips fabricated with 15nm process technology and are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices.
The new products integrate NAND chips fabricated with a controller to manage basic control functions for NAND applications in a single package. In October 2014, Toshiba launched the first eMMC products supporting all mandatory features of JEDEC eMMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of eMMC Version 5.1, "command queuing" and "secure write protection".
The "command queuing feature" allows users to process multiple tasks generated by the user's issue of multiple commands, in the order of the user's preference, by initially storing the tasks in a waiting queue. It improves random read performance speed by approximately 30% at maximum compared to Toshiba existing products. It effectively improves the user experience when simultaneously executing multiple applications on mobile devices, including smartphones and tablets.
The "secure write protection feature" expands the conventional write protect feature and protects the user's data stored in an assigned area from being overwritten or erased by unauthenticated users.
The Japanese company has started sample shipments of the 16GB and 64GB products, with 32GB and 128GB products to follow.
Model | Capacity | Category | Package | Mass Production |
THGBMHG7C2LBAIL | 16GB | Supreme | 11.5x13x0.8mm | 2Q, 2015 (Apr.-Jun.) |
THGBMHG8C4LBAIR | 32GB | 11.5x13x1.0mm | 2Q, 2015 (Apr.-Jun.) | |
THGBMHG9C8LBAIG | 64GB | 11.5x13x1.2mm | 2Q, 2015 (Apr.-Jun.) | |
THGBMHT0C8LBAIG | 128GB | 11.5x13x1.2mm | 2Q, 2015 (Apr.-Jun.) |
Key Specifications |
|
Interface | JEDEC e∙MMC Version 5.1 standard HS-MMC interface |
Capacity | 16GB, 32GB, 64GB, 128GB |
Power Supply Voltage | 2.7-3.6V (Memory core) 1.7V-1.95V, 2.7V-3.6V (Interface) |
Bus Width | x1, x4, x8 |
Temperature Range | -25oC to +85oC |
Package | 153Ball FBGA - 11.5mm x 13.0mm |